Principles of Wire Tacking
        with Cyanoacrylate

        
        Enhanced Gap Filling

        
        Fillet Forming

        


        

          

            

            A drop or bead of cyanoacrylate 

            (CA) adhesive is applied.
 
            

            

            

            CA adhesive flows along the surface and “self-levels.”
            Result is low gap fill, poor bridging ability.
 
          
          

            

            

            

             
 
            

            

          
        

          

            

            A gentle “mist” of Accelerator 

            immediately sets the surface of the 

            CA adhesive - prevents 

            “self-leveling” and migration.
 
            

             
 
          
          

            

            

            

            Accelerator is a catalyst: 

            the cure reaction continues 

            through the mass of CA. 

            Very high gap fill.
 
          
        

          

            

            Wire Tacking
             
          
          

            

            

            

            Wire is held to the circuit board, a bead
            of CA is applied and Accelerated. Hold wire in position 3–5
            seconds to allow the adhesive to fixture. 

            Wire’s diameter is “tacked” by cured CA mass.
            Perfect for all wire & insulation coverings.
 
          
          

            

            Fillet Forming
             
          
          

            

            

            

            CA is applied & accelerated. Hold until
            fixtured. CA forms fillet. 

            Uses: secure large components to boards prior to wave soldering;
            add strength to prevent component–lead flexure; provide
            strain relief; etc. 

            Excellent for coil termination.
 
          
          

            

            Shallow Potting
             
          
          

            

            

            

            Place parts or wires, apply CA, allow to self–level,
            and mist with Accelerator. 

            Allow 30–45 seconds to set.
 
          
          

            

            Accelerator Guidelines
             
          
          

            

            
Accelerator Sequence


            
Accelerator may be used before or after
            adhesive is applied. Sequence of use affects bond strength:

            

            
Accelerate BEFORE for lower strength
            bonds.Adhesive cures “away”
            from accelerator catalyst layer - less “surface” bonding
            occurs, lower strength adhesion. Use for more temporary tacking.

            

            
Accelerate AFTER for HIGHER strength
            bonds.Adhesive wets contact
            surfaces when applied first and then misted with accelerator
            - high specific adhesion, excellent bond strength.

            

            
Use “Sparingly”

            A gentle “mist” to the surface of the liquid CA 

            is adequate to start the cure process.

            


            
Excessive spraying will cause the CA to
            “shatter” or “popcorn” (white, crumbly appearance)
            — result is a very low strength, inferior polymer density.


            Less is better.